Erratum: “Thermal Stability Enhancement in Nanostructured Cu Films Containing Insoluble Tungsten Carbides for Metallization” [J. Mater. Res. 20, 1379 (2005)]

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ژورنال

عنوان ژورنال: Journal of Materials Research

سال: 2005

ISSN: 0884-2914,2044-5326

DOI: 10.1557/jmr.2005.0179